Selection Guide for Sputtering Targets for Semiconductors
What Are Sputtering Targets?
Sputtering targets are high-purity materials used in physical vapor deposition (PVD) processes to create thin films on substrates such as silicon wafers. During sputtering, high-energy ions bombard the target surface, ejecting atoms that deposit onto the substrate to form uniform layers. These layers are essential for constructing conductive interconnects, barrier layers, and insulating films in integrated circuits (ICs).
Key Characteristics of Semiconductor-Grade Targets:
- Ultra-High Purity (5N+): Semiconductor applications require purity levels above 99.999% to reduce defects and maintain electrical performance.
- Microstructural Uniformity: Achieving consistent film properties requires strict control over grain size, density, and crystallographic orientation.
- Customization: Targets are tailored in shapes (e.g., rectangular, circular) and compositions (e.g., pure metals, alloys) to meet specific process requirements.
Semiconductor Target Quickly View: Types & Applications
The main types of metal sputtering targets used in the semiconductor chip industry include: high-purity sputtering targets such as copper, tantalum, aluminum, titanium, cobalt and tungsten, as well as sputtering targets of alloys such as nickel platinum and tungsten titanium.
- Copper targets and tantalum targets are usually used together. At present, the manufacturing of wafers is moving towards smaller processes, and the application of copper wire processes is gradually increasing. Therefore, the demand for copper and tantalum targets continues to grow.
- Aluminum targets and titanium targets are usually used together. At present, in areas such as automotive electronic chips that require technology nodes above 110 nm to ensure their stability and anti-interference, aluminum and titanium targets are still needed in large quantities.
| Materials | Application | Description | Price |
|---|---|---|---|
| Copper Target | Conductive layer | High-purity copper materials are very effective in improving chip integration due to their low resistance, so they are widely used as wiring materials in technology nodes below 110nm. | Inquiry |
| Tantalum Target | Barrier layer | High-purity tantalum targets are mainly used in high-end semiconductor chips below 90nm on 12-inch wafers. | Inquiry |
| Aluminum Target | Conductive layer | High-purity aluminum targets are widely used in making conductive layers of semiconductor chips, but are rarely used in technology nodes below 110nm due to their response speed. | Inquiry |
| Titanium Target | Barrier layer | High-purity titanium targets are mainly used in 130 and 180nm technology nodes on 8-inch wafers. | Inquiry |
| Nickel-Vanadium Alloy Target | Adhesion layer and barrier layer | With high adhesion, anti-diffusion ability and corrosion resistance, it is often used as adhesion layer and barrier layer in chip packaging. | Inquiry |
| Cobalt Target | Contact layer | Can form a thin film with the silicon layer on the surface of the chip to play a contact role. | Inquiry |
| Tungsten-Titanium Alloy Target | Contact layer | Tungsten-titanium alloy can be used as a contact layer material in the gate circuit of the chip due to its advantages such as low electron mobility. | Inquiry |
| Tungsten Target | Mainly used in the field of semiconductor chip memory. | Inquiry |
Alfa Chemistry's Solution
Alfa Chemistry provides a combination of high-purity semiconductor-grade sputtering targets to meet the semiconductor industry's stringent requirements for material performance:
- Purity level: 5N (99.999%) and above, reducing device failure caused by impurities.
- Customized service: supports shape (circular, rectangular) and component ratio adjustment to meet the needs of different PVD equipment.
- Application support: provides technical consultation from material selection to process optimization to help customers improve yield.