Sb Sputtering Targets

Alfa Chemistry provides high-purity antimony (Sb) sputtering targets in different specifications. Sb sputtering targets can be used to prepare optoelectronic devices such as LEDs, laser diodes, photodiodes and solar cells. You can view detailed information about Sb sputtering targets below.
Basic Information
Items | Sb Sputtering Targets |
---|---|
Catalog | ACAM-ST-CM002 |
Material | Antimony |
Symbol | Sb |
Color | Silvery, Lustrous Gray |
Thermal Conductivity (W/m·K) | 24 |
Melting Point (°C) | 630 |
Theoretical Density (g/cc) | 6.68 |
Coefficient Of Thermal Expansion | 11 x 10-6/K |
Purity | 99.999% |
* If you need Sb sputtering targets of other purities, please contact us for customization.
Regular Size
Diameter (inch) | Thick (inch) |
---|---|
1.00 | 0.125 |
1.00 | 0.250 |
2.00 | 0.125 |
2.00 | 0.250 |
3.00 | 0.125 |
3.00 | 0.250 |
4.00 | 0.125 |
4.00 | 0.250 |
6.00 | 0.125 |
6.00 | 0.250 |
* Some of the Sb sputtering targets of the above sizes are in stock, and other sizes can be customized. Please send us an inquiry for more information.
Bonded Assemblies Specifications
Material | Target Size | Purity | Bonding Type | Backing Plate Size |
---|---|---|---|---|
Antimony | 1.00" Diameter × 0.125" Thick | 99.999% | Indium | 1.00" Diameter × 0.125" Thick |
Antimony | 2.00" Diameter × 0.125" Thick | 99.999% | Indium | 2.00" Diameter × 0.125" Thick |
Antimony | 2.00" Diameter × 0.125" Thick | 99.999% | Elastomer | 2.00" Diameter × 0.125" Thick |
Antimony | 3.00" Diameter × 0.125" Thick | 99.999% | Indium | 3.00" Diameter × 0.125" Thick |
Antimony | 3.00" Diameter × 0.125" Thick | 99.999% | Elastomer | 3.00" Diameter × 0.125" Thick |
Material Forms
In addition to round Sb sputtering targets, we also provide Sb sputtering targets in other forms, such as square targets, tube targets, arc targets and special-shaped targets.


Alfa Chemistry specializes in the production of Sb sputtering targets with the highest possible density and highest possible purity. We'll help you choose the right target materials, manufacturing processes, bonded assemblies and backing plates. If you have any questions or needs, please do not hesitate to contact us.
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