Tungsten - Copper / Rod
Description
Tungsten-Copper (W-Cu) Rod is made up of a mixture of tungsten and copper. These alloy rods are useful for their low thermal expansion, high wear resistance, low consumption, high arc resistance, and high thermal and electrical conductivity. Along with the change of composition, the properties change. The dominating characteristics of the tungsten copper rods composed of high copper ratios are transpiration cooling and thermal shock resistance. As the copper proportion goes down, the high temperature strength of the tungsten structure starts to become more pronounced.
Alfa Chemistry is a trusted manufacturer and supplier of high-quality tungsten-copper rods. We are capable of producing tungsten-copper rods in a range of diameters from 0.75 to 127mm or larger. We can also customize various shapes of tungsten-copper alloy products according to your requirements or drawings.
General Properties
Items | Tungsten – Copper / Rod |
---|---|
Catalog | ACAM-W-A005 |
Material | W-Cu |
Purity | Cu (10%-50%) |
Size | Diameter: 0.75-127mm, Length: 3.8-1000mm |
Type | Infiltrated sintering and thermal pressing |
Standard | ASTM B702 |
Physical Properties
Class | Density (g/cm3) | Electrical Conductivity (IACS % Min.) | CTE (10-6 K-1) | Thermal Conductivity (W/m · K-1) | Hardness (HRB Min.) | Specific Heat (J/g · K) |
---|---|---|---|---|---|---|
W50Cu50 | 12.2 | 66.1 | 12.5 | 310 | 81 | 0.259 |
W60Cu40 | 13.7 | 55.2 | 11.8 | 280 | 87 | 0.23 |
W70Cu30 | 14 | 52.1 | 9.1 | 230 | 95 | 0.209 |
W75Cu25 | 14.8 | 45.2 | 8.2 | 220 | 99 | 0.196 |
W80Cu20 | 15.6 | 43 | 7.5 | 200 | 102 | 0.183 |
W85Cu15 | 16.4 | 37.4 | 7 | 190 | 103 | 0.171 |
W90Cu10 | 16.75 | 32.5 | 6.4 | 180 | 107 | 0.158 |
Applications
Common applications of tungsten-copper rod include:
- For cooling device in electronic equipment.
- Being adopted as electrodes in resistance welding machine.
- Arcing contacts and vacuum contacts in high and medium voltage breakers or vacuum interrupters adopt it as material.
- Being adopted as passive cooling element in heat sink for electronic devices and electronic packaging materials.
- As the component of the pushing device in spacecrafts.