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Tungsten - Copper / Plate


Description

Tungsten - Copper / Plate

Tungsten-Copper (W-Cu) alloy is a material composed of tungsten and copper. It has an extremely high melting point which depends on the ratio of the two metals used in the alloy but typically ranges between 1400 and 1800℃, making it suitable for many applications that require materials with a high degree of heat resistance. In addition, tungsten copper alloy’s mechanical properties make it an excellent choice for use in components with high wear resistance.

Alfa Chemistry specializes in providing high tungsten-copper plates on the market today. We can also customize various shapes of tungsten-copper alloy products according to your requirements or drawings.

General Properties

ItemsTungsten – Copper/ Plate
CatalogACAM-W-A004
MaterialW-Cu
PurityCu (10%-50%)
SizeThickness: 0.1-200mm, Width: 20-2500mm
SurfaceGrinding Polished
TypeHot rolled, Cold rolled

Physical Properties

ClassChemical Composition(Wt%)DensityHardnessResistance rateIACSBending strength
CuTotal Additives ≤W
W93Cu077±1.00.5Remainder17.52707.2261190
W90Cu1010±2.00.5Remainder16.752606.5271160
W85Cu1515±2.00.5Remainder15.92405.7301080
W80Cu2020±2.00.5Remainder15.15220534980
W75Cu2525±2.00.5Remainder14.51954.538885
W70Cu3030±2.00.5Remainder13.81754.142790
W65Cu450.545±2.00.5Remainder13.31553.944650
W60Cu4040±2.00.5Remainder12.751403.747600
W55Cu4545±2.00.5Remainder12.31253.549565
W50Cu5050±2.00.5Remainder11.851153.254534

Applications

Tungsten-Copper plate is composed of a high melting point, high hardness and high conductivity and high thermal conductivity of copper, so it has good resistance to arc, welding resistance and high strength, high hardness and other advantages. Tungsten-Copper plate has been widely used in vacuum high voltage switch and other electrical contact materials, resistance welding and EDM electrode materials, electronic packaging materials, electronic devices and heat sink substrate material, radiation shielding material, high density weight materials etc.